Job description preview
From Intel’s original posting
Job Details: Job Description: Intel's APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both Intel Foundry Services (IFS) and Intel Product Groups (IPG). The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones. Key Responsibilities • Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness. • Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification…
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