Broadcom

ChipFab Product/Process Engineer

Malaysia-Penang B 1 & 2Posted 14 days ago
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From Broadcom’s original posting

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Job Description • New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines. • New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production. • New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor. • Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement. • Line Sustaining,…

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