Job description preview
From Broadcom’s original posting
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: JD: • Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. • Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing. • Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity • Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time. • Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements • Drive capability enhancement and cost reduction projects • Qualification of new suppliers / new site and support…
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