Applied Materials
Advanced Packaging Process Support Engineer
Icheon-Gwango,KORPosted 5 days ago
What you'd do
- Provide on-site technical support for Applied KINEX hybrid bonding systems at customer semiconductor fabs
- Support and optimize die-to-wafer bonding processes for advanced packaging applications
- Design and execute process experiments and DOE,analyze data,and deliver technical conclusions
What they want
- Bachelor degree in Materials Science,Chemistry,Electrical Engineering,Semiconductor Engineering,or related field
- 3 to 10 years of experience in semiconductor process engineering,equipment support,or advanced packaging
- English proficiency for technical communication and reporting
Nice to have
- Experience with hybrid bonding,die-to-wafer bonding,or advanced packaging technologies
- Familiarity with CVD,ALD,PVD,etch,anneal,or implant processes