Packaging Module Development Engineer
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From Intel’s original posting
Job Details: Job Description: • Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. • CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process. • Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle. • Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization. • Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories. • Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. • Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. • Conducting fundamental studies and performing experiments to characterize materials, process, identify potential…
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