Applied Materials
Principal/ Staff Engineer, Advanced Packaging Process Integration
7 LocationsPosted 2 days ago
What you'd do
- Lead development and optimization of advanced packaging processes including 2.5D/3D IC packaging
- Manage projects from conception to production,meeting timelines and budgets
- Provide technical guidance and mentorship to the engineering team
What they want
- Bachelor's degree in engineering,materials science,physics,or related field
- Extensive experience in semiconductor process integration with advanced packaging focus
- Proven track record managing complex projects and leading engineering teams
Nice to have
- Advanced degree (Master's or PhD) in engineering or related field
- Familiarity with industry standards and regulations for semiconductor packaging
- Up-to-date knowledge of emerging trends in semiconductor packaging technologies