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Package PI/SI Engineer
Seoul, South KoreaPosted 6 months ago
What you'd do
- Perform DC/AC analysis including IR Drop and PDN impedance profiling for stable power delivery.
- Conduct electromagnetic simulations to mitigate crosstalk,reflection,and insertion loss on high-speed interfaces.
- Lead implementation of next-generation packaging solutions (2.5D/3D,Chiplets) and automated design flows.
What they want
- 10+ years of experience in power integrity and signal integrity engineering.
- Expert-level proficiency with SI/PI simulation tools (ANSYS HFSS,SIwave,Cadence Sigrity,or Keysight ADS).
- Proven ability to correlate simulations with measurements using VNA,TDR,and 10GHz+ oscilloscopes.
Nice to have
- Deep understanding of HBM3E PHY,D2D PHY,and Ethernet PHY standards.
- Experience designing high-speed package architecture and multi-layer semiconductor substrates.
Seoulstart's read
- Visa tier (likely)
- E-7 specialty / professional (likely)
- Korean language
- Korean not required
- English friendliness
- High: JD in English, foreign-friendly signals