Job description preview
From Ecolab’s original posting
Lead the development of next-generation silicon direct cooling technologies vis-à-vis Micro Channel Lid or Direct Silicon cooling to enable higher-performance computing platforms, collaborating closely with cross-functional engineering teams and external ecosystem partners including semiconductor packaging providers, silicon/ASIC vendors, and system integrators (ODMs). Drive thermal management innovation across platforms ranging from general-purpose servers to advanced GPU systems, while demonstrating technical leadership in packaging technologies to address increasingly complex cooling challenges driven by rising compute density and power requirements Key Objectives & Success Measures Develop strong partnerships with external compute systems that are pertinent to the program Negotiate for win-win on terms and conditions with internal and external partners Define short and long-term milestones with all parties Flawlessly execute the agreed upon milestones and track progress Develop key IPs for CoolIT where possible to strengthen our foothold in this field Key Responsibilities Technical Development & Leadership • Build out the internal and external support infrastructure for this…
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