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From Intel’s original posting
Job Details: Job Description: The Role and Impact: We are seeking a passionate Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site supporting Intel's packaging programs. The scope will be supporting C4 bumping and interconnect quality for WPM (wafer packaging manufacturing/ 3D Foveros technology) and ATM (assembly technology Mfg/ traditional package level assembly). You will play a critical role in ensuring our products and bumping processes meet the highest quality and reliability standards from wafer fabrication through packaging and assembly. This position is pivotal to the success of our manufacturing operations, directly impacting the performance of our products and customer satisfaction. By driving continuous process improvements and proactive quality initiatives, you will contribute to building a culture of excellence while helping Intel maintain its reputation as an industry leader. This role provides the opportunity to influence development forums, and factory operations while advancing cutting-edge manufacturing practices. Key Responsibilities: • Manage manufacturing excursions while driving continuous improvement: chair MRB…
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