Applied Materials
Advanced Packaging Process Support Engineer
Hwaseong-Lucestar,KORPosted 12 days ago
What you'd do
- Provide on-site technical support for Applied KINEX bonding systems including installation and qualification
- Support and optimize die-to-wafer bonding processes for advanced semiconductor packaging
- Collaborate with customers and R&D teams to develop leading-edge packaging processes
What they want
- Hands-on experience with semiconductor packaging or bonding process engineering
- Ability to support on-site installations,diagnoses,and repair of complex equipment
- Experience developing and executing hypothesis-driven experiments (DOEs)
Nice to have
- Experience with hybrid bonding or die-to-wafer bonding technology
- Background in CVD,ALD,PVD,or Etch semiconductor processes